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| MCP9700/9700A MCP9701/9701A Low-Power Linear Active ThermistorTM ICs Features * Tiny Analog Temperature Sensor * Available Packages: - SC70-5, SOT-23-5, TO-92-3 * Wide Temperature Measurement Range: - -40C to +125C (Extended Temperature) - -40C to +150C (High Temperature) (MCP9700/9700A) * Accuracy: - 2C (max.), 0C to +70C (MCP9700A/9701A) - 4C (max.), 0C to +70C (MCP9700/9701) * Optimized for Analog-to-Digital Converters (ADCs): - 10.0 mV/C (typical) MCP9700/9700A - 19.5 mV/C (typical) MCP9701/9701A * Wide Operating Voltage Range: - VDD = 2.3V to 5.5V MCP9700/9700A - VDD = 3.1V to 5.5V MCP9701/9701A * Low Operating Current: 6 A (typical) * Optimized to Drive Large Capacitive Loads Description The MCP9700/9700A and MCP9701/9701A family of Linear Active ThermistorTM Intergrated Circuit (IC) is an analog temperature sensor that converts temperature to analog voltage. It's a low-cost, low-power sensor with an accuracy of 2C from 0C to +70C (MCP9700A/9701A) 4C from 0C to +70C (MCP9700/9701) while consuming 6 A (typical) of operating current. Unlike resistive sensors (such as thermistors), the Linear Active Thermistor IC does not require an additional signal-conditioning circuit. Therefore, the biasing circuit development overhead for thermistor solutions can be avoided by implementing this low-cost device. The voltage output pin (VOUT) can be directly connected to the ADC input of a microcontroller. The MCP9700/9700A and MCP9701/9701A temperature coefficients are scaled to provide a 1C/bit resolution for an 8-bit ADC with a reference voltage of 2.5V and 5V, respectively. The MCP9700/9700A and MCP9701/9701A provide a low-cost solution for applications that require measurement of a relative change of temperature. When measuring relative change in temperature from +25C, an accuracy of 1C (typical) can be realized from 0C to +70C. This accuracy can also be achieved by applying system calibration at +25C. In addition, this family is immune to the effects of parasitic capacitance and can drive large capacitive loads. This provides Printed Circuit Board (PCB) layout design flexibility by enabling the device to be remotely located from the microcontroller. Adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. However, capacitive load is not required for sensor output stability. 3-Pin SOT-23 MCP9700/9700A MCP9701/9701A GND 3 5-Pin SC70 MCP9700/9700A MCP9701/9701A NC 1 GND 2 VOUT 3 1 VDD 2 VOUT 4 VDD 5 NC Typical Applications * * * * * * Hard Disk Drives and Other PC Peripherals Entertainment Systems Home Appliance Office Equipment Battery Packs and Portable Equipment General Purpose Temperature Monitoring Package Type 3-Pin TO-92 MCP9700/9701 Only 123 Bottom View 1 VDD VOUT GND (c) 2009 Microchip Technology Inc. DS21942E-page 1 MCP9700/9700A and MCP9701/9701A NOTES: DS21942E-page 2 (c) 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 1.0 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings VDD:...................................................................... 6.0V Storage temperature: ........................ -65C to +150C Ambient Temp. with Power Applied:.. -40C to +150C Output Current ................................................. 30 mA Junction Temperature (TJ): ................................ 150C ESD Protection On All Pins (HBM:MM): ....(4 kV:200V) Latch-Up Current at Each Pin: ...................... 200 mA DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40C to +125C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10C to +125C and No load. Parameter Power Supply Operating Voltage Range Operating Current Power Supply Rejection Sensor Accuracy (Notes 1, 2) TA = +25C TA = 0C to +70C TA = -40C to +125C TA = -10C to +125C TA = 0C to +70C TA = -40C to +125C TA = -10C to +125C TA = -40C to +150C Sensor Output Output Voltage, TA = 0C Output Voltage, TA = 0C Temperature Coefficient Output Non-linearity Output Current Output Impedance Output Load Regulation Turn-on Time Note 1: 2: 3: V0C V0C TC TC VONL IOUT ZOUT VOUT/ IOUT tON -- -- -- -- -- -- -- -- -- 500 400 10.0 19.5 0.5 -- 20 1 800 -- -- -- -- -- 100 -- -- -- mV mV MCP9700/9700A MCP9701/9701A TACY TACY TACY TACY TACY TACY TACY TACY -- -2.0 -2.0 -2.0 -4.0 -4.0 -4.0 -4.0 1 1 1 1 2 2 2 2 -- +2.0 +4.0 +4.0 +4.0 +6.0 +6.0 +6.0 C C C C C C C C MCP9700A/9701A MCP9700A MCP9701A MCP9700/9701 MCP9700 MCP9701 High Temperature, MCP9700 only VDD VDD IDD C/VDD 2.3 3.1 -- -- -- -- 6 0.1 5.5 5.5 12 -- V V A C/V MCP9700/9700A MCP9701/9701A Sym Min Typ Max Unit Conditions mV/C MCP9700/9700A mV/C MCP9701/9701A C A s IOUT = 100 A, f = 500 Hz TA = 0C to +70C, IOUT = 100 A TA = 0C to +70C (Note 2) The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-16. SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). (c) 2009 Microchip Technology Inc. DS21942E-page 3 MCP9700/9700A and MCP9701/9701A DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40C to +125C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10C to +125C and No load. Parameter Typical Load Capacitance Sym CLOAD Min -- Typ -- Max 1000 Unit pF Conditions The MCP9700/9700A and MCP9701/9701A family is characterized and production tested with a capacitive load of 1000 pF. 30C (Air) to +125C (Fluid Bath) (Note 3) SC-70 Thermal Response to 63% TO-92 Thermal Response to 63% Note 1: 2: 3: tRES tRES -- -- 1.3 1.65 -- -- s s The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-16. SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40C to +125C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10C to +125C and No load. Parameters Temperature Ranges Specified Temperature Range (Note 1) TA TA TA Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5LD SC70 Thermal Resistance, 3LD SOT-23 Thermal Resistance, 3LD TO-92 Note 1: JA JA JA -- -- -- 331 308 146 -- -- -- C/W C/W C/W TA TA TA -40 -10 -40 -40 -40 -65 -- -- -- -- -- -- +125 +125 +150 +125 +150 +150 C C C C C C MCP9700/9700A MCP9701/9701A High Temperature, MCP9700 only Extended Temperature High Temperature Sym Min Typ Max Units Conditions M Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150C). DS21942E-page 4 (c) 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 F. 6.0 5.0 Accuracy (C) 3.0 2.0 1.0 0.0 -1.0 -2.0 -50 -25 0 25 50 75 TA (C) 100 125 150 MCP9700A VDD= 3.3V MCP9701A VDD= 5.0V Spec. Limits 6.0 4.0 Accuracy (C) 2.0 0.0 -2.0 -4.0 -50 MCP9700 VDD= 3.3V 4.0 MCP9701 VDD= 5.0V Spec. Limits -25 0 25 50 75 TA (C) 100 125 150 FIGURE 2-1: Accuracy vs. Ambient Temperature (MCP9700A/9701A). 6.0 4.0 Accuracy (C) 2.0 0.0 -2.0 -4.0 -50 -25 0 25 50 75 TA (C) 100 125 150 MCP9700 MCP9700A VDD = 5.5V VDD = 2.3V MCP9701/ MCP9701A VDD= 5.5V VDD= 3.1V FIGURE 2-4: Accuracy vs. Ambient Temperature (MCP9700/9701). 0.2 ILOAD = 100 A Accuracy Due to Load (C) 0.1 0 MCP9701/MCP9701A VDD = 5.0V -0.1 -0.2 -50 -25 0 MCP9700/MCP9700A VDD = 3.3V 25 50 75 TA (C) 100 125 150 FIGURE 2-2: Accuracy vs. Ambient Temperature, with VDD. 12.0 10.0 8.0 IDD (A) 6.0 4.0 2.0 0.0 -50 -25 0 25 50 75 TA (C) 100 125 150 MCP9700/MCP9700A MCP9701 MCP9701A FIGURE 2-5: Changes in Accuracy vs. Ambient Temperature (Due to Load). 4.0 Load Regulation V/I () 3.0 2.0 1.0 0.0 -50 -25 0 25 50 TA (C) 75 100 125 MCP9700/MCP9700A MCP9701/MCP9701A VDD = 3.3V IOUT = 50 A IOUT = 100 A IOUT = 200 A FIGURE 2-3: Temperature. Supply Current vs. FIGURE 2-6: Load Regulation vs. Ambient Temperature. (c) 2009 Microchip Technology Inc. DS21942E-page 5 MCP9700/9700A and MCP9701/9701A Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 F. 35% 30% Occurrences 25% 20% 15% 10% 5% 0% 500 400 520 540 420 440 460 480 560 580 600 V0C (mV) MCP9700 35% VDD = 3.3V 108 samples MCP9700A 30% Occurrences 25% 20% 15% 10% 5% 0% MCP9701 VDD = 5.0V 108 samples MCP9701A MCP9701 V0C (mV) FIGURE 2-7: Output Voltage at 0C (MCP9700/9700A). 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% FIGURE 2-10: Output Voltage at 0C (MCP9701/9701A). 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% Occurrences 10.0 10.1 10.2 10.2 10.3 10.4 10.5 9.7 9.8 9.8 9.9 Occurrences MCP9700 MCP9700A VDD = 3.3V 108 samples MCP9701 MCP9701A VDD = 5.0V 108 samples 19.5 19.6 19.3 19.4 19.2 19.3 19.7 19.7 19.8 19.9 TC (mV/C) TC (mV/C) FIGURE 2-8: Occurrences vs. Temperature Coefficient (MCP9700/9700A). 0.30 Normalized PSRR (C/V) 0.25 0.20 0.15 0.10 0.05 0.00 -50 -25 0 25 50 75 TA (C) 100 125 150 MCP9700/MCP9700A VDD= 2.3V to 4.0V FIGURE 2-11: Occurrences vs. Temperature Coefficient (MCP9701/9701A). 0.30 Normalized PSRR (C/V) 0.25 0.20 0.15 0.10 0.05 0.00 -50 -25 0 25 50 TA (C) 75 100 125 MCP9701/MCP9701A MCP9701/MCP9701A VDD= 3.1V to 4.0V 3.1V to 4.0V MCP9700/MCP9700A VDD= 2.3V to 5.5V MCP9701/MCP9701A MCP9701/MCP9701A VDD= 3.1V to 5.5V 3.1V to 5.5V FIGURE 2-9: Power Supply Rejection (C/VDD) vs. Ambient Temperature. FIGURE 2-12: Power Supply Rejection (C/VDD) vs. Temperature. DS21942E-page 6 (c) 2009 Microchip Technology Inc. 20.0 500 300 320 340 360 380 400 420 440 460 480 MCP9700/9700A and MCP9701/9701A Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 F. 1.6 1.4 1.2 V OUT (V) VOUT (V) 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) TA = +26C 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 125 TA (C) MCP9700 MCP9700A MCP9701 MCP9701A FIGURE 2-13: Supply. 12 10 8 6 VOUT (V) 4 2 0 0.0 Output Voltage vs. Power FIGURE 2-16: Temperature. Output Voltage vs. Ambient 2.5 IDD (mA) VDD_STEP = 5V TA = 26C IDD 3.0 2.5 2.0 1.5 V OUT (V) 1.0 0.5 0.0 VOUT IDD 1.7 0.8 0.0 18.0 6.0 -6.0 -18.0 -30.0 -42.0 VOUT -0.8 -1.7 -2.5 0.5 -0.1 0.6 0.1 0.2 0.3 0.4 0.7 0.8 0.9 1.0 Time (ms) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms) FIGURE 2-14: step VDD. 130 105 TA (C) 80 55 30 -2 0 2 4 Output vs. Settling Time to FIGURE 2-17: Ramp VDD. 1000 Output vs. Settling Time to SC70-5 1 in. x 1 in. Copper Clad PCB Output Impedance () VDD = 5.0V IOUT = 100 A TA = +26C 100 Leaded, without PCB SC70-5 SOT-23-3 TO-92-3 10 6 8 10 12 14 16 18 1 Time (s) 0.1 0. 1 1 100 1k 10 10 100 1000 Frequency (Hz) 10000 100000 10k 100k FIGURE 2-15: Fluid Bath). Thermal Response (Air to FIGURE 2-18: Frequency. Output Impedance vs. (c) 2009 Microchip Technology Inc. DS21942E-page 7 IDD (A) VDD_RAMP = 5V/ms TA = +26C 30.0 MCP9700/9700A and MCP9701/9701A NOTES: DS21942E-page 8 (c) 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed Table 3-1. TABLE 3-1: Pin No. SC70 1 2 3 4 5 PIN FUNCTION TABLE Pin No. SOT-23 -- 3 2 1 -- Pin No. TO-92 -- 3 2 1 -- Symbol NC GND VOUT VDD NC Function No Connect (this pin is not connected to the die). Power Ground Pin Output Voltage Pin Power Supply Input No Connect (this pin is not connected to the die). 3.1 Power Ground Pin (GND) 3.3 Power Supply Input (VDD) GND is the system ground pin. 3.2 Output Voltage Pin (VOUT) The operating voltage as specified in the "DC Electrical Characteristics" table is applied to VDD. The sensor output can be measured at VOUT. The voltage range over the operating temperature range for the MCP9700/9700A is 100 mV to 1.75V and for the MCP9701/9701A, 200 mV to 3V . 3.4 No Connect Pin (NC) This pin is not connected to the die. It can be used to improve thermal conduction to the package by connecting it to a Printed Circuit Board (PCB) trace from the thermal source. (c) 2009 Microchip Technology Inc. DS21942E-page 9 MCP9700/9700A and MCP9701/9701A NOTES: DS21942E-page 10 (c) 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 4.0 APPLICATIONS INFORMATION 3.0 2.0 Accuracy (C) 1.0 0.0 -1.0 -2.0 -3.0 -50 -25 0 25 50 TA (C) 75 100 125 VDD= 3.3V 10 Samples The Linear Active ThermistorTM IC uses an internal diode to measure temperature. The diode electrical characteristics have a temperature coefficient that provides a change in voltage based on the relative ambient temperature from -40C to 150C. The change in voltage is scaled to a temperature coefficient of 10.0 mV/C (typical) for the MCP9700/9700A and 19.5 mV/C (typical) for the MCP9701/9701A. The output voltage at 0C is also scaled to 500 mV (typical) and 400 mV (typical) for the MCP9700/9700A and MCP9701/9701A, respectively. This linear scale is described in the first-order transfer function shown in Equation 4-1 and Figure 2-16. EQUATION 4-1: SENSOR TRANSFER FUNCTION FIGURE 4-2: vs. Temperature. Relative Accuracy to +25C V OUT = T C * T A + V 0C Where: TA = Ambient Temperature VOUT = Sensor Output Voltage V0C = Sensor Output Voltage at 0C (See DC Electrical Characteristics table) TC = Temperature Coefficient (See DC Electrical Characteristics table) The change in accuracy from the calibration temperature is due to the output non-linearity from the first-order equation, as specified in Equation 4-2. The accuracy can be further improved by compensating for the output non-linearity. For higher accuracy using a sensor compensation technique, refer to AN1001 "IC Temperature Sensor Accuracy Compensation with a PICmicro(R) Microcontroller" (DS01001). The application note shows that if the MCP9700 is compensated in addition to room temperature calibration, the sensor accuracy can be improved to 0.5C (typical) accuracy over the operating temperature (Figure 4-3). 6.0 VDD VOUT GND VSS ANI VDD Accuracy (C) 100 Samples 4.0 2.0 0.0 -2.0 -4.0 +s Average -s Spec. Limits MCP9700 PICmicro(R) MCU VSS -50 -25 0 25 50 75 100 125 Temperature (C) FIGURE 4-1: Typical Application Circuit. 4.1 Improving Accuracy FIGURE 4-3: Sensor Accuracy. MCP9700/9700A Calibrated The MCP9700/9700A and MCP9701/9701A accuracy can be improved by performing a system calibration at a specific temperature. For example, calibrating the system at +25C ambient improves the measurement accuracy to a 0.5C (typical) from 0C to +70C, as shown in Figure 4-2. Therefore, when measuring relative temperature change, this family measures temperature with higher accuracy. The compensation technique provides a linear temperature reading. A firmware look-up table can be generated to compensate for the sensor error. (c) 2009 Microchip Technology Inc. DS21942E-page 11 MCP9700/9700A and MCP9701/9701A 4.2 Shutdown Using Microcontroller I/O Pin 4.4 Thermal Considerations The MCP9700/9700A and MCP9701/9701A family measures temperature by monitoring the voltage of a diode located in the die. A low-impedance thermal path between the die and the PCB is provided by the pins. Therefore, the sensor effectively monitors the temperature of the PCB. However, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. This limitation applies to plastic-packaged silicon temperature sensors. If the application requires measuring ambient air, consider using the TO-92 package. The MCP9700/9700A and MCP9701/9701A is designed to source/sink 100 A (max.). The power dissipation due to the output current is relatively insignificant. The effect of the output current can be described using Equation 4-2. The MCP9700/9700A and MCP9701/9701A family of low operating current of 6 A (typical) makes it ideal for battery-powered applications. However, for applications that require tighter current budget, this device can be powered using a microcontroller Input/ Output (I/O) pin. The I/O pin can be toggled to shut down the device. In such applications, the microcontroller internal digital switching noise is emitted to the MCP9700/9700A and MCP9701/9701A as power supply noise. This switching noise compromises measurement accuracy. Therefore, a decoupling capacitor and series resistor will be necessary to filter out the system noise. 4.3 Layout Considerations The MCP9700/9700A and MCP9701/9701A family does not require any additional components to operate. However, it is recommended that a decoupling capacitor of 0.1 F to 1 F be used between the VDD and GND pins. In high-noise applications, connect the power supply voltage to the VDD pin using a 200 resistor with a 1 F decoupling capacitor. A high frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the VDD and GND pins in order to provide effective noise protection. In addition, avoid tracing digital lines in close proximity to the sensor. EQUATION 4-2: EFFECT OF SELFHEATING T J - T A = JA ( V DD I DD + ( V DD - V OUT ) I OUT ) Where: TJ = Junction Temperature TA = Ambient Temperature JA = Package Thermal Resistance (331C/W) VOUT = Sensor Output Voltage IOUT = Sensor Output Current IDD = Operating Current VDD = Operating Voltage At TA = +25C (VOUT = 0.75V) and maximum specification of IDD = 12 A, VDD = 5.5V and IOUT = +100 A, the self-heating due to power dissipation (TJ - TA) is 0.179C. DS21942E-page 12 (c) 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 5.0 5.1 PACKAGING INFORMATION Package Marking Information 3-Lead SOT-23 Example: XXNN Device MCP9700T MCP9700AT MCP9701T MCP9701AT Code AENN AFNN AMNN APNN AE25 Note: Applies to 3-Lead SOT-23 3-Lead TO-92 Example: XXXXXX XXXXXX XXXXXX YWWNNN MCP 9700E e3 TO^^ 916256 5-Lead SC70 Example: XXNN Device MCP9700T MCP9700AT MCP9701T MCP9701AT Code AUNN AXNN AVNN AYNN AU25 Note: Applies to 5-Lead SC70. Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. (c) 2009 Microchip Technology Inc. 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DS21942E-page 15 MCP9700/9700A and MCP9701/9701A /HDG 3ODVWLF 6PDOO 2XWOLQH 7UDQVLVWRU 77 >627 1RWH @ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ b N E E1 1 e e1 D 2 A c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page 16 (c) 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A /HDG 3ODVWLF 7UDQVLVWRU 2XWOLQH 72 >72 1RWH @ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ E A 1 N L 12 3 b e c D R 8QLWV 'LPHQVLRQ /LPLWV 1XPEHU RI 3LQV 3LWFK %RWWRP WR 3DFNDJH )ODW 2YHUDOO :LGWK 2YHUDOO /HQJWK 0ROGHG 3DFNDJH 5DGLXV 7LS WR 6HDWLQJ 3ODQH /HDG 7KLFNQHVV 1 H ' ( $ 5 / F %6& 0,1 ,1&+(6 0$; /HDG :LGWK E 1RWHV 'LPHQVLRQV $ DQG ( GR QRW LQFOXGH PROG IODVK RU SURWUXVLRQV 0ROG IODVK RU SURWUXVLRQV VKDOO QRW H[FHHG 'LPHQVLRQLQJ DQG WROHUDQFLQJ SHU $60( < 0 %6& %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV SHU VLGH 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ & % (c) 2009 Microchip Technology Inc. DS21942E-page 17 MCP9700/9700A and MCP9701/9701A NOTES: DS21942E-page 18 (c) 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A APPENDIX A: REVISION HISTORY Revision E (April 2009) The following is the list of modifications: 1. 2. 3. 4. Added High Temperature option throughout document. Updated plots to reflect the high temperature performance. Updated Package Outline drawings. Updated Revision history. Revision D (October 2007) The following is the list of modifications: 1. 2. 3. Added the 3-lead SOT-23 devices to data sheet. Replaced Figure 2-15. Updated Package Outline Drawings. Revision C (June 2006) The following is the list of modifications: 1. 2. Added the MCP9700A and MCP9701A devices to data sheet. Added TO92 package for the MCP9700/ MCP9701. Revision B (October 2005) The following is the list of modifications: 1. 2. 3. 4. 5. Added Section 3.0 "Pin Descriptions". Added the Linear Active ThermistorTM IC trademark. Removed the 2nd order temperature equation and the temperature coeficient histogram. Added a reference to AN1001 and corresponding verbiage. Added Figure 4-2 and corresponding verbiage. Revision A (November 2005) * Original Release of this Document. (c) 2009 Microchip Technology Inc. DS21942E-page 19 MCP9700/9700A and MCP9701/9701A NOTES: DS21942E-page 20 (c) 2009 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device - X /XX Package Examples: a) b) MCP9700T-E/LT: MCP9700-E/TO: MCP9700T-E/TO: MCP9700T-H/LT: Linear Active ThermistorTM IC, Tape and Reel, 5LD SC70 package. Linear Active ThermistorTM IC, 3LD TO-92 package. Linear Active ThermistorTM IC, Tape and Reel, 3LD SOT-23 package. Linear Active ThermistorTM IC, Tape and Reel, High Temperature, 5LD SC70 package. Temperature Range Device: Linear Active ThermistorTM IC, Tape and Reel, Pb free MCP9700AT: Linear Active ThermistorTM IC, Tape and Reel, Pb free MCP9701T: Linear Active ThermistorTM IC, Tape and Reel, Pb free MCP9701AT: Linear Active ThermistorTM IC, Tape and Reel, Pb free = = -40C to +125C -40C to +150C (MCP9700 only) Plastic Small Outline Transistor, 5-lead Plastic Small Outline Transistor, 3-lead Plastic Small Outline Transistor, 3-lead MCP9700T: c) d) a) Temperature Range: E H Package: b) LT = TO = TT = MCP9700AT-E/LT: Linear Active ThermistorTM IC, Tape and Reel, 5LD SC70 package. MCP9700AT-E/TO: Linear Active ThermistorTM IC, Tape and Reel, 3LD SOT-23 package. MCP9701T-E/LT: MCP9701-E/TO: MCP9701T-E/TO: Linear Active ThermistorTM IC, Tape and Reel, 5LD SC70 package. Linear Active ThermistorTM IC, 3LD TO-92 package. Linear Active ThermistorTM IC, Tape and Reel, 3LD SOT-23 package. a) b) c) a) b) MCP9701AT-E/LT: Linear Active ThermistorTM IC, Tape and Reel, 5LD SC70 package. MCP9701AT-E/TO: Linear Active ThermistorTM IC, Tape and Reel, 3LD SOT-23 package. (c) 2009 Microchip Technology Inc. DS21942E-page 21 MCP9700/9700A and MCP9701/9701A NOTES: DS21942E-page 22 (c) 2009 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2009 Microchip Technology Inc. DS21942E-page 23 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4080 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 03/26/09 DS21942E-page 24 (c) 2009 Microchip Technology Inc. |
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